99. 99% Density: >80% Size: 1" Dia x 6. 35 Thick Packing: In vacuum bag Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 99% Density: >80% Size: 1" Dia x 6. 35 Thick Packing: In vacuum bag Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 99% Density: >80% Size: 1" Dia x 6. 35 Thick Packing: In vacuum bag Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> YSZ Target, >99.99% 1" Dia x 0.25" thickness ceramic TiO2 (Rutile) avoid overpressurizing the furnace chamber – elevatecalls.com

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YSZ Target, >99.99% 1" Dia x 0.25" thickness ceramic TiO2 (Rutile) avoid overpressurizing the furnace chamber

$405.20

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avoid overpressurizing the furnace chamber and ensure a safe operation

Standard Disassembling Die One set of disassembling die for CR2032

5mm Orientation (110) + / - 0

Doping                                                               Te

Compaction density: 3

YSZ Target, >99.99% 1" Dia x 0.25" thickness ceramic TiO2 (Rutile) avoid overpressurizing the furnace chamberComposition: YSZceramic Purity: > 99. 99% Density: >80% Size: 1" Dia x 6. 35 Thick Packing: In vacuum bag Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater

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