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Cycles - Specification for stem wedge angle Ingestion-build-205840 This part of IEC 60749

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This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method

Requirements for registration and approval

experimental results are given

amongst others

Old references to ISO/R 230:1961 have been changed to ISO 230-1:2012 and all observations have been updated accordingly

Cycles - Specification for stem wedge angle Ingestion-build-205840 This part of IEC 60749

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