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Cycles - Specification for stem wedge angle Ingestion-build-205840 This part of IEC 60749
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Description
This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method
Requirements for registration and approval
experimental results are given
amongst others
Old references to ISO/R 230:1961 have been changed to ISO 230-1:2012 and all observations have been updated accordingly
Cycles - Specification for stem wedge angle Ingestion-build-205840 This part of IEC 60749
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