Ge Substrate: (100) 5x5 x 0.5 mm , 1SP, N type Sb doped,R>40 Ohm.cm CdS Use the MSK-118A folding machine

Use the MSK-118A folding machine to partially fold the edge

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One needle valve is built-in to control gas flowing rate

One stainless steel sleeve is in outside to protect die from cracking

8 pt 0 2 MicrosoftInternetExplorer4 Layers from outside (Shiny) to the inside (Mat)

Ge Substrate: (100) 5x5 x 0.5 mm , 1SP, N type Sb doped,R>40 Ohm.cm CdS Use the MSK-118A folding machineGe Wafer Specification Growing Method: CZ Wafer Size: 5x5 x0. 5 mm Surface Polishing: one side epi polished Orientation: (100) Surface roughness: RMS or Ra:~ 10 A(By AFM) Doping: Sb doped Conductor type: N type Resistivity: >40 Ohms cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.) Package: under 1000 class clean room in wafer container Related Product Other Crystal wafer A