G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical Control

G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds StdTpc-Statistical ControlThis Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages. The procedures include shear test, pull test, and three point bending techniques. This Standard may be used on all types of semiconductor leadframe and molding compound. The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a

This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and their interchangeability at all mechanical interfaces

4  Because no chuck is used as a measurement reference

SEMI E117-1104 (Reapproved 0816)

components

This Document applies only to hydrogen gas delivered through pipelines

and description of the SECS-II messages

SEMI F78-0703 (first published)

and Services

SEMI MF1810-1110 (Reapproved 1115)

SEMI M49 — Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generation

This Test Method is especially applicable for silicon where boron is an unintentional p-type contaminant at trace levels (<5 × 1014 atoms/cm3)

This Document defines relation with main part of SEMI E54 including Common Device Model (CDM) and existing Specific Device Models (SDMs)