G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Revision:Default Title SEMI E82-0704 (technical revision)

SEMI E82-0704 (technical revision)

and employees must be trained

The subject of this Specification is the activities of a processing location (i

Factual correctness and Reasoning

The pellicle exclusion volume of this Specification accommodates pellicles which extend the full length of the reticle and up to a maximum pellicle width of 124 mm

G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Revision:Default Title SEMI E82-0704 (technical revision)This specification defines the standard requirements for co fired ceramic fine pitch chip carrier constructions, including both top brazed leaded and top metallized leadless configurations. These constructions are for hermetic packaging of various devices, (e. g., high speed, digital VLSI silicon devices), and next level interconnection to printed wiring assemblies and modules by either lead solder attachment or by "leads last" techniques. Referenced